pga sockets interstitial pga sockets low insertion force .100/(2.54mm) staggered grid 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) footprint dash # if applicable * 1 rsx 503 - 234 m g contact plating terminal plating terminal type body type rohs compliant insulators: ksx - peel-a-wayrsx - hi-temp molded lcp number of pins 004 to 2209 *footprints available online see options on next page rohs compliant: g - goldm - matte tin t - tin/lead rohs compliant: g - goldt - tin/lead ? options how to order note: t erminals plated with matte t in are available only with gold plated cont act s. features: ? low insertion for ce (1 oz. average per pin). ? screw-machined terminals withmulti-finger contacts for reliability . ? closed bottom terminal for 100%anti-wicking of solder . ? t apered entr y for ease of insertion. ? custom designs available. specifications: terminals: brass - copper alloy(c36000) astm-b-16 contacts: ber yllium copper (c17200) astm-b-194 solder preform: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu plating: g - gold over nickelm - matte t in over nickel t - t in/lead over nickel gold per astm-b-488matte t in per astm545-97 t in/lead per mil-p-81728 nickel per qq-n-290 tape seal - add 3m to end of part number ? removable t ape seal protect s plated cont act in harsh environment s ? sealed socket will not allow dirt and other cont aminant s to enter socket chamber and become entrapped behind cont act fingers ? s pray flux without cont aminating cont act area material silicone backed polyimide film, -74c to 260c (-100f to 500f) intermittent to 371c (700f) rsx replaces csx. description: peel-a-w ay ? (ksx) material: polyimide filmindex: -269c to 400c (-452f to 752f) description: molded (rsx) mat?l: high t emp. liquid cryst al polymer (lcp) index: -40c to 260c (-40f to 500f) .100 (2.54) molded body type -235shown .005 typ. (.13) type -210shown table of models
interstitial pga sockets low insertion force .100/(2.54mm) staggered grid pga sockets 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) .180 (4.57) .165 (4.19) .059 dia. (1.50) .018 dia. (.46) .209 (5.31) .136 (3.45) .059 dia. (1.50) .018 dia. (.46) standard terminals solder preform terminals type -210 type -176 type -234 type -82 peel-a-w ay ? only .058 dia. (1.47) .034 dia. (.86) .015 (.38) .155 (3.94) .058 dia. (1.47) .155 (3.95) .031 (.79) .034 dia. (.86) .125 (3.18) .165 (4.19) .059 dia. (1.50) .018 dia. (.46) type -235 molded only molded only .250 (6.35) .165 (4.19) .056 dia. (1.42) .018 dia. (.46) 2 solder preforms .180 (4.57) .165 (4.19) .059 dia. (1.50) .018 dia. (.46) solder preform tin/lead: type -311 lead-free: type -813 tin/lead: type -313 lead-free: type -814 footprints: ? full grid insulators loaded to yourspecific footprint. ? open centers available uponrequest (consult factor y). ? hundreds of footprints availableonline. ? use our online build-a-partfeature or download a footprints booklet in pdf format. 1.200 sq. (30.48) .100/(2.54) typ. available online: ? extraction t ools ? rohs qualification t est report ? cad drawings molded only molded only peel-a-w ay ? only molded only 4 st andof fs per socket t ype -234 used in remaining positions 180 pins footprint number 180 23 x 23 rows additional standard and custom terminals available.see t erminals section or consult factor y. solder preform .031 (.79) .058 dia. (1.47) .038 dia. (.96) .155 (3.94) tin/lead: type -432 lead-free: type -815 peel-a-w ay ? only intrusive reflow application ? combines the labor of socket loading and solderapplication into one operation. ? eliminates the use of solder p aste and screening operation. ? eliminates solder bridges and/or solder short s due to excess solder . ? ensures a reliable solder joint with controlledsolder volume. ? ideal for surface mount and mixed technologyapplications. ? for custom solder preform terminal applicationsconsult factory . solder preform terminals before reflow after reflow solder preform plated thru hole (pth) pcb pcb
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